Electronic package and method for fabricating the same

ABSTRACT

An electronic package and a method for fabricating the same are provided. The method includes disposing on a carrier an electronic component having a plurality of conductors, encapsulating the electronic component with an encapsulant, and disposing an electronic device on the encapsulant. The electronic device and the carrier are electrically connected through the conductors, thereby reducing the overall thickness of the electronic package.

BACKGROUND 1. Technical Field

The present disclosure relates to electronic packages and methods forfabricating the same, and, more particularly, to a package stackstructure and a method for fabricating the same.

2. Description of Related Art

Along with the progress of semiconductor packaging technologies, variouspackage types have been developed for semiconductor devices. To improveelectrical performance and save space, a plurality of packages can bestacked to form a package on package (PoP) structure. Such a packagingmethod allows merging of heterogeneous technologies in asystem-in-package (SiP) so as to systematically integrate a plurality ofelectronic components having different functions, such as a memory, acentral processing unit (CPU), a graphics processing unit (GPU), animage application processor and so on, and therefore is applicable tovarious thin type electronic products.

FIG. 1 is a schematic cross-sectional view of a conventional packagestack structure 1. The package stack structure 1 has a lower packagingsubstrate 10, a semiconductor element 11 disposed in a flip-chip manneron the lower packaging substrate 10, an upper packaging substrate 12bonded to and electrically coupled to the lower packaging substrate 10through a plurality of supporting solder balls 13, at least anelectronic device 16 such as a memory chip or a memory package structuredisposed in a flip-chip manner on the upper packaging substrate 12, andan encapsulant 14 encapsulating the supporting solder balls 13 and thesemiconductor element 11. Optionally, an underfill 19 is formed betweenthe semiconductor element 11 and the lower packaging substrate 10.

The upper packaging substrate 12 is an organic packaging substrate,which can have a core layer 120 or be a coreless packaging substrate.Since the upper packaging substrate 12 generally has a thickness d ofabout 150 to 800 um, it becomes difficult to reduce the overallthickness D of the package stack structure 1 so as to meet theminiaturization requirement of electronic products.

Further, even if the upper packaging substrate 12 has a small thicknessd, the height R of the supporting solder balls 13 must be greater thanthe height r of the semiconductor element 11 so as to prevent thesemiconductor element 11 from impacting the upper packaging substrate 12and causing damage. Therefore, limited by the height R of the supportingsolder balls 13, the overall thickness D of the package stack structure1 cannot be reduced to be less than 240 um.

Therefore, how to overcome the above-described drawbacks has becomecritical.

SUMMARY

In view of the above-described drawbacks, the present disclosureprovides an electronic package, which comprises: a carrier; anelectronic component disposed on the carrier, wherein the electroniccomponent has a first side bonded to the carrier and a second sideopposite to the first side; a plurality of conductors formed in theelectronic component, communicating the first and second sides of theelectronic component, and electrically connected to the carrier; anencapsulant formed on the carrier to encapsulate the electroniccomponent; and an electronic device disposed on the encapsulant andelectrically connected to the conductors, wherein the conductors arepartially exposed from the encapsulant.

The present disclosure further provides a method for fabricating anelectronic package, which comprises: disposing on a carrier at least anelectronic component that has a first side bonded to the carrier and asecond side opposite to the first side, wherein a plurality ofconductors are formed in the electronic component, communicate the firstand second sides of the electronic component, and are electricallyconnected to the carrier; forming an encapsulant on the carrier toencapsulate the electronic component in a manner that the conductors arepartially exposed from the encapsulant, and disposing an electronicdevice on the encapsulant, wherein the electronic device is electricallyconnected to the conductors, the conductors are partially exposed fromthe encapsulant.

In an embodiment, a plurality of electrode pads are formed on the firstor second side of the electronic component for the electronic componentto be electrically connected to the carrier.

In an embodiment, the conductors protrude from the second side of theelectronic component.

In an embodiment, an insulating material is formed between theelectronic device and the encapsulant. In another embodiment, theinsulating material is a dielectric material, a packaging material or anon-conductive film.

According to the present disclosure, the conductors are formed in theelectronic component to electrically connect the carrier and theelectronic device. Compared with the prior art, the present disclosuredispenses with the conventional upper packaging substrate and thesupporting solder balls. Therefore, the material cost is saved, and thefabrication process is simplified. Further, the overall thickness of theelectronic package is greatly reduced to meet the miniaturizationrequirement of electronic products.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic cross-sectional view of a conventional packagestack structure;

FIGS. 2A to 2D are schematic cross-sectional views showing a method forfabricating an electronic package according to the present disclosure;

FIG. 2E is a schematic partial cross-sectional view showing anotherembodiment of FIG. 2D; and

FIGS. 3 and 4 are schematic cross-sectional views showing otherembodiments of FIG. 2D.

DETAILED DESCRIPTION OF EMBODIMENTS

The following illustrative embodiments are provided to illustrate thedisclosure of the present disclosure, these and other advantages andeffects can be apparent to those in the art after reading thisspecification.

It should be noted that all the drawings are not intended to limit thepresent disclosure. Various modifications and variations can be madewithout departing from the spirit of the present disclosure. Further,terms such as “first”, “second”, “on”, “a” etc. are merely forillustrative purposes and should not be construed to limit the scope ofthe present disclosure.

FIGS. 2A to 2D are schematic cross-sectional views showing a method forfabricating an electronic package according to the present disclosure.

Referring to FIG. 2A, at least an electronic component 21 having aplurality of conductors 23 is disposed on a carrier 20.

In an embodiment, the carrier 20 is a packaging substrate having a corelayer and a circuit structure, or a coreless circuit structure, and thecarrier 20 has a plurality of circuit layers such as fan-outredistribution layers. Alternatively, the carrier 20 can be, forexample, a lead frame.

The electronic component 21 is an active element, such as asemiconductor chip, a passive element, such as a resistor, a capacitoror an inductor, or a combination thereof. For example, the electroniccomponent 21 is a semiconductor chip, which has a first side 21 a (i.e.,an active surface) with a plurality of electrode pads 210 and a secondside 21 b (i.e., an inactive surface) opposite to the first side 21 a.The electrode pads 210 are disposed on and electrically connected to thecarrier 20 through a plurality of conductive bumps 22. The conductivebumps 22 are made of a solder material, for example. In anotherembodiment, referring to FIG. 4, a plurality of electrode pads 410 aredisposed on a second side 21 b (i.e., an active surface) of anelectronic component 41 and electrically connected to the carrier 20through a plurality of bonding wires 42.

The conductors 23 are metal posts, such as copper posts, which areformed in the electronic component 21 by a TSV (through silicon via)process. Each of the conductors 23 has a first end portion 23 a and asecond end portion 23 b opposite to the first end portion 23 a. Thefirst end portions 23 a of the conductors 23 are exposed from the firstside 21 a of the electronic component 21 and electrically connected tothe carrier 20 through a plurality of conductive bumps 22. Theconductive bumps 22 are made of such as a solder material.

Further, an underfill 29 is optionally formed between the first side 21a of the electronic component 21 and the carrier 20 to encapsulate theconductive bumps 22.

Referring to FIG. 2B, an encapsulant 24 is formed on the carrier 20 toencapsulate the electronic component 21.

In an embodiment, the encapsulant 24 is formed by lamination or moldingand made of a dielectric material or a packaging material, for example,polyimide, a dry film, an epoxy resin, or a molding compound.

The encapsulant 24 has a first surface 24 a bonded to the carrier 20 anda second surface 24 b opposite to the first surface 24 a.

In another embodiment, referring to FIG. 3, an encapsulant 34 isoptionally formed between the carrier 20 and the first side 21 a of theelectronic component 21 to encapsulate the conductive bumps 22.

In a further embodiment, referring to FIG. 4, the encapsulant 24encapsulates the bonding wires 42.

Referring to FIG. 2C, a portion of the encapsulant 24 and the electroniccomponent 21 is removed to expose the conductors 23. The conductors 23communicate the first side 21 a and the second side 21 b of theelectronic component 21.

In an embodiment, the second end portion 23 b of the conductors 23protrudes from the second side 21 b of the electronic component 21. Inan embodiment, a leveling process is performed to remove a portion ofthe electronic component 21 from the second side 21 b thereof so as tocause the second end portions 23 b of the conductors 23 to be flush withthe second side 21 b of the electronic component 21. Then, an etchprocess is performed to remove a portion of the electronic component 21from the second side 21 b thereof and hence the second end portion 23 bof the conductors 23 protrudes from the second side 21 b of theelectronic component 21.

In an embodiment, a portion of the encapsulant 24, the conductors 23 andthe electronic component 21 is removed by grinding or cutting so as tocause the second surface 24 b of the encapsulant 24, the second endportions 23 b of the conductors 23 and the second side 21 b of theelectronic component 21 to be coplanar. As such, the thickness T of theelectronic component 21 (or the encapsulant 24 or the conductors 23) isless than 100 um. Then, a dry etch process such as a plasma etch processor a reactive ion etch process is performed to remove a portion of theelectronic component 21 having a thickness t of about 10 um from thesecond side 21 b thereof. Therefore, the second end portion 23 b of theconductors 23 protrudes from the second side 21 b of the electroniccomponent 21.

Further, a plurality of solder balls 25 are formed on a lower surface ofthe carrier 20 so as for a circuit board to be mounted thereon.

Referring to FIG. 2D, an electronic device 26 is disposed on the secondsurface 24 b of the encapsulant 24 and electrically connected to theconductors 23 through a plurality of conductive elements 260. As such, aPoP electronic package 2 is obtained.

In an embodiment, the electronic device 26 is a high bandwidth memory(HBM) package structure, and the conductive elements 260 are conductivebumps containing a solder material.

Further, after the electronic device 26 is disposed on the secondsurface 24 b of the encapsulant 24, an insulating material 27 is formedto encapsulate and thus protect the conductive elements 260. Also, theinsulating material 27 facilitates to enhance the rigidity of theelectronic package 2. The insulating material 27 is made of a dielectricmaterial or a packaging material.

In another embodiment, referring to FIG. 2E, an insulating material 28is formed on the electronic device 26 to encapsulate the conductiveelements 260. Thereafter, the electronic device 26 having the insulatingmaterial 28 is disposed on the second surface 24 b of the encapsulant 24and the conductive elements 260 are bonded and electrically connected tothe conductors 23. As such, the insulating material 28 protects theconductive elements 260 and enhances the rigidity of the electronicpackage 2. The insulating material 28 can have a flux function and canbe a non-conductive film such as an anisotropic conductive paste or ananisotropic conductive film.

According to the present disclosure, the conductors 23 are disposed inthe electronic component 21, 41 to electrically connect the carrier 20and the electronic device 26. Compared with the prior art, the presentdisclosure dispenses with the conventional upper packaging substrate andthe supporting solder balls. Therefore, the material cost is saved andthe fabrication process is simplified. Since the overall thickness H ofthe electronic package 2, 3, 4 mainly depends on the thickness h of theelectronic component 21, 41 (or the thickness T of the conductors 23),the overall thickness H of the electronic package 2, 3, 4 can be greatlyreduced to be less than 240 um, thus meeting the miniaturizationrequirement of electronic products.

The present disclosure further provides an electronic package 2, 3, 4,which has: a carrier 20; an electronic component 21, 41 disposed on thecarrier 20, wherein the electronic component 21 has a first side 21 abonded to the carrier 20 and a second side 21 b opposite to the firstside 21 a; a plurality of conductors 23 formed in the electroniccomponent 21, 41, communicating the first and second sides 21 a, 21 b ofthe electronic component 21, and electrically connected to the carrier20; an encapsulant 24, 34 formed on the carrier 20 to encapsulate theelectronic component 21, 41, wherein the conductors 23 are partiallyexposed from the encapsulant 24, 34; and an electronic device 26disposed on the encapsulant 24, 34 and electrically connected to theconductors 23.

In an embodiment, a plurality of electrode pads 210, 410 are disposed onthe first side 21 a or the second side 21 b of the electronic component21, 41 and electrically connected to the carrier 20.

In an embodiment, the conductors 23 protrude from the second side 21 bof the electronic component 21, 41.

In an embodiment, an insulating material 27, 28 is formed between theelectronic device 26 and the encapsulant 24, 34. In an embodiment, theinsulating material 27, 28 is a dielectric material, a packagingmaterial or a non-conductive film.

According to the present disclosure, the conductors are formed in theelectronic component to electrically connect the carrier and theelectronic device. Compared with the prior art, the present disclosuredispenses with the conventional upper packaging substrate and thesupporting solder balls, and reduces the fabrication cost and theoverall thickness of the electronic package.

The above-described descriptions of the detailed embodiments are only toillustrate the implementation according to the present disclosure, andit is not to limit the scope of the present disclosure. Accordingly, allmodifications and variations completed by those with ordinary skill inthe art should fall within the scope of present disclosure defined bythe appended claims.

What is claimed is:
 1. An electronic package, comprising: a carrier; anelectronic component disposed on the carrier and having a first sidebonded to the carrier and a second side opposite to the first side; aplurality of conductors formed in the electronic component,communicating the first and second sides of the electronic component,and electrically connected to the carrier; an encapsulant formed on thecarrier and encapsulating the electronic component, with the conductorsbeing partially exposed from the encapsulant; and an electronic devicedisposed on the encapsulant and electrically connected to theconductors.
 2. The electronic package of claim 1, wherein the electroniccomponent comprises a plurality of electrode pads disposed on the firstor second side thereof for the electronic component to be electricallyconnected to the carrier.
 3. The electronic package of claim 1, whereinthe conductors protrude from the second side of the electroniccomponent.
 4. The electronic package of claim 1, further comprising aninsulating material formed between the electronic device and theencapsulant.
 5. The electronic package of claim 4, wherein theinsulating material is a dielectric material, a packaging material or anon-conductive film.
 6. A method for fabricating an electronic package,comprising: disposing on a carrier at least an electronic componenthaving a first side bonded to the carrier and a second side opposite tothe first side, wherein a plurality of conductors are formed in theelectronic component, communicate the first and second sides of theelectronic component and are electrically connected to the carrier;forming on the carrier an encapsulant for encapsulating the electroniccomponent, with the conductors being partially exposed from theencapsulant; and disposing on the encapsulant an electronic deviceelectrically connected to the conductors.
 7. The method of claim 6,wherein the electronic component has a plurality of electrode padsdisposed on the first or second side thereof for the electroniccomponent to be electrically connected to the carrier.
 8. The method ofclaim 6, wherein the conductors protrude from the second side of theelectronic component.
 9. The method of claim 6, further comprisingforming an insulating material between the electronic device and theencapsulant.
 10. The method of claim 9, wherein the insulating materialis a dielectric material, a packaging material or a non-conductive film.